71st Japan Society of Applied Physics Spring Meeting

Date and Time: March 22 (Friday) – 25 (Monday), 2024
Venue: Tokyo City University, Setagaya Campus

Official website: 71st Japan Society of Applied Physics Spring Meeting

We will be exhibiting jointly with HORIBA Techno Service Co., Ltd. and holding a luncheon seminar. We look forward to seeing you there.

Luncheon Seminar

Schedule: March 24 (Sunday), 12:10–12:50
Venue: 1BJ / 100-person capacity room
Fee: Free ※ Lunch will be provided
Title: Latest Analysis Examples of Cathode Materials by XPS and AFM-Raman, and Introduction of Efforts to Improve Analysis and Data Processing Efficiency through Coordinate Sharing
Speakers: Shinichi Iida, ULVAC-PHI, Inc.
　　　　Tomoko Numata, HORIBA Techno Service Co., Ltd.

Overview

Achieving carbon neutrality hinges on the effective utilization of renewable energy and the electrification of vehicles, including automobiles.
To achieve this goal, the development of advanced battery materials with high energy density, long cycle life, and sufficient safety is essential.
Furthermore, high-precision and multi-faceted analysis using multiple techniques and instruments is necessary for rapid development.
This time, we will introduce applications evaluating and analyzing the local surface of the latest cathode materials using ULVAC-PHI’s cutting-edge surface analysis instruments and HORIBA’s Raman spectroscopy, as well as our efforts to accelerate and streamline analytical operations through coordinate sharing between different instruments.

How to Participate in the Luncheon Seminar

Please register through the participation registration on the official website and join us. Separate registration is also required for the luncheon seminar (free of charge).

Click here to register for the luncheon seminar

Please note that the luncheon seminar is open to academic conference participants only.

ULVAC-PHI, Inc., HORIBA Techno Service Co., Ltd., and HORIBA, Ltd. will jointly use the customer’s name, company name, email address, and other information entered in relation to this event, as well as information obtained through business card exchanges. ULVAC-PHI, Inc., HORIBA Techno Service Co., Ltd., and HORIBA, Ltd. will use the above information to provide customers with information regarding each company’s products and services, within the scope of their respective privacy policies.