73rd Japan Society of Applied Physics Spring Meeting

Date and Time: March 15 (Sunday) – 18 (Wednesday), 2026
Venue: Tokyo Institute of Science, Ookayama Campus

We will be exhibiting jointly with HORIBA Techno Service Co., Ltd. and holding a luncheon seminar. We look forward to seeing you there.

Luncheon Seminar

Date: March 15, 2026 (Sunday), 11:50–12:30
Venue: W2-401 (West Building No. 2) / 50-person capacity room
Fee: Free ※ Lunch will be provided

Title: Evaluation of Advanced Materials Combining XRF and XPSスピーカー：アルバック・ファイSpeakers: Maki Hashimoto, ULVAC-PHI, Inc.
　　　　　　Yuki Izumi, HORIBA Techno Service Co., Ltd.

Overview

As materials and devices become increasingly sophisticated, layer structures have grown more complex, making it difficult to identify the causes of anomalies using a single analytical technique. Multimodal analysis, which combines techniques that capture elemental distribution with those that analyze chemical bonding states and depth-direction changes, and evaluates them in a complementary manner, is therefore becoming increasingly important.
In this seminar, we will introduce analysis examples of fuel cell electrode membranes (CCMs) using a combination of μ-XRF and XPS, targeting polymer electrolyte fuel cells (PEFCs), which are attracting attention for next-generation automobiles. Furthermore, we will present application examples combining XRF and RF-GD-OES with XPS for hard disk drive materials, and explain the effectiveness of this approach in evaluating complex materials and layer structures.

How to Participate in the Luncheon Seminar

Please register through the participation registration on the official website and join us. Separate registration is also required for the luncheon seminar (free of charge).

Please note that the luncheon seminar is open to academic conference participants only.

Exhibition (Poster Session Venue)

1-26 (Indoor Gymnasium PA (1F Arena))

ULVAC-PHI, Inc., HORIBA Techno Service Co., Ltd., and HORIBA, Ltd. will jointly use the customer’s name, company name, email address, and other information entered in relation to this event, as well as information obtained through business card exchanges. ULVAC-PHI, Inc., HORIBA Techno Service Co., Ltd., and HORIBA, Ltd. will use the above information to provide customers with information regarding each company’s products and services, within the scope of their respective privacy policies.