Event Information
- 会期
- 2025.01.29（水） — 31（金）
- 会場
- Grand Cube Osaka (Osaka Prefectural International Convention Center)
- ブース
- G-07
Event period: January 29 (Wednesday) – 31 (Friday), 2025
Venue: Grand Cube Osaka (Osaka Prefectural International Convention Center) Organizer’s
website: https://www.kansai-jasis.jp/
Please complete visitor pre-registration before attending!
＊Please print your “Entry Pass” yourself in A4 size, at 100%, in color, and bring it with you.
Exhibition Booth
G-07
At our exhibition booth, we will be introducing the latest surface analysis technologies, including HAXPES for non-destructive depth profiling, UPS/LEIPS for obtaining ionization potential and electron affinity information, Ar-GCIB (Argon Gas Cluster Ion Beam) essential for depth profiling of organic materials, MS/MS indispensable for molecular structure analysis in TOF-SIMS, as well as AES and dynamic SIMS.
As a special collaboration, we will introduce our efforts toward detailed analysis at the same location using ULVAC-PHI’s cutting-edge surface analysis instruments and HORIBA’s AFM-Raman spectroscopy instrument, along with analysis examples.
New Technology Presentation
| Date and Time | Theme (Content) | Venue |
| January 29 (Wednesday) 15:30–16:00 | Analysis examples of semiconductor materials using the fully automatic multifunctional scanning XPS instrument PHI GENESIS | Meeting Room 1004 |
| January 30 (Thursday) 13:00–13:30 | Latest application examples using ULVAC-PHI’s TOF-SIMS analytical instruments | Meeting Room 1007 |