72nd Japan Society of Applied Physics Spring Meeting

Technical Symposium 2025.03.14 — 03.17

Event Information

会期
2025.03.14(金) — 17(月)
会場
Tokyo University of Science, Noda Campus
入場料
Free
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Date and Time: March 14 (Friday) – 17 (Monday), 2025
Venue: Tokyo University of Science, Noda Campus

We will be exhibiting jointly with HORIBA Techno Service Co., Ltd. and holding a luncheon seminar. We look forward to seeing you there.

Luncheon Seminar

Date: March 14, 2025 (Friday), 12:10–12:50
Venue: K207 (Lecture Building, 2F, Room 207) / 100-person capacity room
Fee: Free ※ Lunch will be provided

Title: Efficient Collection of XPS and Raman Data at the Same Location Using the Coordinate Sharing System nanoGPS
Speakers: Maki Hashimoto, ULVAC-PHI, Inc.
      Shoji Oka, HORIBA Techno Service Co., Ltd.

Overview

When measuring samples with repeating structures such as patterned wafers, electronic substrates, inkjet nozzles, and displays, or a large number of samples with the same shape, accurate identification of measurement locations is critically important. However, maintaining this precision when using multiple instruments is not straightforward. By utilizing the coordinate sharing system “nanoGPS,” we have achieved highly accurate and efficient collection of XPS and Raman data from the same locations. In this seminar, we will introduce the latest methods.

How to Participate in the Luncheon Seminar

Please register through the participation registration on the official website and join us. Separate registration is also required for the luncheon seminar (free of charge).

Please note that the luncheon seminar is open to academic conference participants only.

Exhibition

Venue: E-101 (Poster Session Venue (Morito Memorial Gymnasium))

ULVAC-PHI, Inc., HORIBA Techno Service Co., Ltd., and HORIBA, Ltd. will jointly use the customer’s name, company name, email address, and other information entered in relation to this event, as well as information obtained through business card exchanges. ULVAC-PHI, Inc., HORIBA Techno Service Co., Ltd., and HORIBA, Ltd. will use the above information to provide customers with information regarding each company’s products and services, within the scope of their respective privacy policies.

CONTACT

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